Strong presence on the EMBC 2018
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With 8 accepted papers, the department of Biomedical Microtechnology is strongly represented on this year´s international conference for biomedical engineering EMBC (International Conference of the IEEE Engineering in Medicine and Biology Society) in Hawaii. From July 17th – 21st, industrial and academic scientists come together at the world´s largest international biomedical engineering meeting to present their newest developments and research results.
Congratulations to Michael Langenmair who has made it to the finals of the student paper competition with his contribution „Low Temperature Approach for High Density Electrical Feedthroughs for Neural Implants Using Maskless Fabrication Techniques“.
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